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EV Group unveils laser debonding solution for fan-out wafer-level packaging

Published 06 July 2017

Equipment and process solutions supplier EV Group (EVG) has unveiled its laser debonding solution for fan-out wafer level packaging (FoWLP).

The solution allows high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages.

The solution is designed as a platform for integration in EVG 850 DB automated debonding system, EVG’s benchmark.

It features a solid-state laser and beam-shaping optics to enable optimized, force-free debonding.

The solution has low temperature debonding and potential to process high temperature, and is also used for processing compound semiconductors and power devices.

EV Group executive technology director Paul Lindner said: “The semiconductor industry and its touch points grow more diverse by the day. The Internet of Things, automotive advancements, communications and virtual needs are now all being driven by the advancements in this industry.

"Many of these developments are now taking place at the packaging level, where the need for greater device functionality and smaller form factors has led to more complex packages, stacked packages, systems in package, as well as high-performance packages.

“EVG's temporary bonding and debonding solutions, including our latest-generation laser debonding module, play a crucial role in enabling wafer thinning to address the smaller form factors required for these new packaging architectures and applications."

FoWLP provides the capability to offer consumers and mobile devices with very thin devices and system integration, having enhanced performance, functionality and design flexibility.

According to Yole Développement, a research and strategy consulting firm, FoWLP will have $3bn and a compound annual growth rate (CAGR) of 36% in 2022.

The new solution’s temperature stability will enable easy detachment of bonding adhesive materials without affecting other materials in the package.